On June 28, 2025, the Shanghai Key Laboratory of Critical Process Materials for Integrated Circuits (hereinafter referred to as "the Laboratory") successfully hosted the Seminar on Advanced Interconnection Technologies for Integrated Circuits during the 4th High-End Manufacturing Electronic Electroplating Forum (FEPAM-2025). The seminar brought together experts from industry, academia, and research sectors to jointly discuss technological advancements and industrialization applications.

At the opening ceremony, Dr. Wang Su, Director of the Laboratory, delivered a speech on behalf of the host. He pointed out that as chip manufacturing processes approach physical limits, interconnection technology has become increasingly critical, and innovations in electronic electroplating technology are essential to achieving the independent and controllable development of the industrial chain. Meanwhile, Dr. Wang Su expressed special gratitude to Academician Sun Shigang for his strong support for the seminar, as well as the research team led by Professor Hong Wenjing from Xiamen University for their dedicated efforts in the forum’s preparation.

Subsequently, Sun Hongqi, Deputy Director of the Laboratory, presented the Laboratory’s research achievements in electroplating solution formulations and additive systems. He stated that as an open platform, the Laboratory will continue to commit itself to building a collaborative innovation ecosystem and providing opportunities for cooperation and exchange within the industry. In his report, Shi Jianbin, Deputy Secretary-General of the Shanghai Integrated Circuit Industry Association, analyzed the current status of the industry. He noted that although Shanghai has formed a complete integrated circuit industrial chain, some high-end electronic chemicals still rely on imports, making it imperative for industry, academia, and research to collaborate to tackle these "bottleneck" challenges.

The technical session featured a diverse array of highlights. The research team led by Professor Qu Xinping from Fudan University developed a novel alkaline-acid composite electroplating process, overcoming the challenge of metal filling for through-silicon vias (TSVs) with small dimensions and high aspect ratios. The team led by Associate Professor Wu Yunwen from Shanghai Jiao Tong University innovatively proposed technologies for bilayer nanotwinned bonding and low-temperature, large-grain copper-copper bonding. The research team led by Professor Yu Daquan from Xiamen University achieved a breakthrough in TSV processes with an aspect ratio of up to 20:1. In terms of equipment and materials, Wang He, General Manager of Xindong Microelectronics, pointed out that domestic electroplating equipment is now making the leap from "import substitution" to "technological leadership". The research team led by Dr. Qi Lianshan from Shanghai Sinyang developed a new type of cobalt sulfate electroplating additive, providing a reliable solution for advanced manufacturing processes.

At the closing of the seminar, Dr. Wang Su delivered a concluding speech. He noted that the event demonstrated cutting-edge breakthroughs in the field of electronic electroplating and the great potential of collaborative innovation among industry, academia, and research. Addressing the issue of information barriers in current university-enterprise cooperation, he emphasized that the Laboratory will continue to leverage its platform role to promote process sharing and joint R&D, thereby supporting the integrated circuit industry of China to achieve independent and innovative development at a higher level.