• Suitable for hole structures with various aspect ratios, delivering highly efficient and uniform filling to meet diverse complex design requirements.
• Featuring superior bottom-up filling performance, it effectively prevents the formation of voids or seams and ensures full coverage of the material within microstructures.
• Enables defect-free complete filling in hole structures of different types and sizes, guaranteeing filling reliability.
• After annealing, the material exhibits excellent crystalline quality with a dense and uniform microstructure, and is completely free of micro-voids.
Bumping
Product Applications
• Comprehensive processes for Cu, Sn, etc.
• 8/12-inch processes
• Supporting Equipment: AMAT, LAM and NEXX
Product Characteristics
• Excellent uniformity and coplanarity ensure uniform metal distribution on the substrate and high surface planarity, effectively reducing offset and defects during the bumping process and improving the reliability and consistency of overall assembly.
• Low Kirkendall voiding between copper and tin reduces porosity formation, thereby enhancing the stability and mechanical strength of interfacial bonding.
• Enables high-speed pillar plating while ensuring uniform plating thickness and dense structure, meeting the requirements of high-precision electronic manufacturing.
High-selectivity Copper/Titanium
Product Applications
• Copper and titanium etching process after electroplating
• 8/12-inch processes
Product Characteristics
• Fast and high etching rate with excellent uniformity.
• High etching precision.
• Wide process window with a large range of operating parameters.
• High environmental friendliness, meeting the requirements of green manufacturing and sustainable development.
